Contact

BRS - Bright Red Systems GmbH
Plüddemanngasse 39
8010 Graz - Austria

office@brs.eu.com
+43 316 232 106

Please fill in all fields marked with *

Captcha + 61 = 62

Contact

BRS - Bright Red Systems GmbH
Plüddemanngasse 39
8010 Graz - Austria

office@brs.eu.com
+43 316 232 106

Please fill in all fields marked with *

Captcha + 67 = 73

Wafer Edge Screener
HP 15K

  • profiles the wafer edge thickness
  • quantifies broken and chipped wafer edges
  • differentiates between upper and lower wafer edge defects
  • measures wafer bow
  • works with opaque or transparent wafers independently of any wafer surface
  • generates 3D thin wafer models for accurate single step pre-alignment
  • logs wafer edge defects for statistical analysis
  • works as stand-alone system with fully embedded data processing
  • classifies wafers according to SEMI Standard
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Benefits

Save inspection time

Precisely profile wafer edges during common wafer pre-alignment processes and boost throughput.

Maximise Equipment Uptime

Reliably identify damaged wafer edges before running critical operations and avoid in-process wafer breakage

Increase Yield

Easily identify processes as well as equipment responsible for edge defects and optimise production.

Applications

Wafer Edge Inspection

Wafer Edge Screeners quantify upper and lower edge defects as well as broken edges by profiling the wafer edge thickness.

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Wafer Bow Measurement

Wafer Edge Screeners determine wafer bow to ensure safe handling.

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Thin Wafer Pre-alignment

Wafer Edge Screeners determine the most accurate pre-alignment parameters by incorporating wafer bow data.

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Analytics and Statistics

Wafer Edge Screeners acquire data of wafer defects for statistical analysis and provide direct connectivity to your Manufacturing Execution System.

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The Story

Market

MarketsandMarkets reports that in 2015 the semiconductor‘s thin wafer market was valued at USD 6.76 Billion and is projected to reach USD 9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. This market affects MEMS, CMOS Image Sensors, Memory, RF Devices, LEDs, as well as power devices for e-mobility applications.

Problem

While this market is growing, problems have increased because wafers are getting thinner and thus more likely to break. This breakage is caused by broken and chipped wafer edges which may result in functional failure or total wafer breakage. Production processes as well as production equipment responsible for these kinds of defects have to be identified and improved.

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